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  2. List of integrated circuit packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_integrated_circuit...

    Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.

  3. Siemens NX - Wikipedia

    en.wikipedia.org/wiki/Siemens_NX

    Siemens NX. NX, formerly known as "Unigraphics", is an advanced high-end CAD / CAM / CAE, which has been owned since 2007 by Siemens Digital Industries Software. [1][2] In 2000, Unigraphics purchased SDRC I-DEAS and began an effort to integrate aspects of both software packages into a single product which became Unigraphics NX or NX.

  4. Comparison of EDA software - Wikipedia

    en.wikipedia.org/wiki/Comparison_of_EDA_software

    This page is a comparison of electronic design automation (EDA) software which is used today to design the near totality of electronic devices. Modern electronic devices are too complex to be designed without the help of a computer. Electronic devices may consist of integrated circuits (ICs), printed circuit boards (PCBs), field-programmable ...

  5. Nastran - Wikipedia

    en.wikipedia.org/wiki/Nastran

    NASTRAN is a finite element analysis (FEA) program that was originally developed for NASA in the late 1960s under United States government funding for the aerospace industry. The MacNeal-Schwendler Corporation (MSC) was one of the principal and original developers of the publicly available NASTRAN code. [1][2] NASTRAN source code is integrated ...

  6. Plant Simulation - Wikipedia

    en.wikipedia.org/wiki/Plant_Simulation

    Plant Simulation is a computer application developed by Siemens Digital Industries Software for modelling, simulating, analyzing, visualizing and optimizing production systems and processes, the flow of materials and logistic operations. [2] Plant Simulation, [3] allows users to optimize material flow and resource utilization and logistics for ...

  7. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...

  8. UGS Corp. - Wikipedia

    en.wikipedia.org/wiki/UGS_Corp.

    UGS was a computer software company headquartered in Plano, Texas, specializing in 3D & 2D Product Lifecycle Management (PLM) software. Its operations were amalgamated into the Siemens Digital Industries Software business unit of Siemens Industry Automation division, when Siemens completed the US$3.5 billion acquisition of UGS on May 7, 2007.

  9. Computer-aided design - Wikipedia

    en.wikipedia.org/wiki/Computer-aided_design

    Computer-aided design (CAD) is the use of computers (or workstations) to aid in the creation, modification, analysis, or optimization of a design. [1]: 3 This software is used to increase the productivity of the designer, improve the quality of design, improve communications through documentation, and to create a database for manufacturing. [1 ...

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