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  2. Isothermal transformation diagram - Wikipedia

    en.wikipedia.org/wiki/Isothermal_transformation...

    Time-Temperature-Transformation diagram for two steels: one with 0.4% wt. C (red line) and one with 0.4% wt. C and 2% weight Mn (green line). P = pearlite, B = bainite and M = martensite. Isothermal transformation diagrams (also known as time-temperature-transformation ( TTT ) diagrams ) are plots of temperature versus time (usually on a ...

  3. Thermal decomposition - Wikipedia

    en.wikipedia.org/wiki/Thermal_decomposition

    Thermal decomposition, or thermolysis, is a chemical decomposition of a substance caused by heat. The decomposition temperature of a substance is the temperature at which the substance chemically decomposes.

  4. Thermogravimetric analysis - Wikipedia

    en.wikipedia.org/wiki/Thermogravimetric_analysis

    Thermogravimetric analysis or thermal gravimetric analysis (TGA) is a method of thermal analysis in which the mass of a sample is measured over time as the temperature changes. . This measurement provides information about physical phenomena, such as phase transitions, absorption, adsorption and desorption; as well as chemical phenomena including chemisorptions, thermal decomposition, and ...

  5. Thermosetting polymer - Wikipedia

    en.wikipedia.org/wiki/Thermosetting_polymer

    Left: individual linear polymer chains Right: Polymer chains which have been cross linked to give a rigid 3D thermoset polymer. In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (). [1]

  6. Curing (chemistry) - Wikipedia

    en.wikipedia.org/wiki/Curing_(chemistry)

    Figure 4: Evolution in time of storage modulus G' and loss modulus G" during a curing reaction. A simple way to monitor the change in viscosity, and thus, the extent of the reaction, in a curing process is to measure the variation of the elastic modulus. [7] To measure the elastic modulus of a system during curing, a rheometer can be used. [7]

  7. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Bonding at specific temperature, ambient pressure for specific amount of time; Post-bake/hard-cure to form solid BCB monomer layer; The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [17]

  8. Heat treating - Wikipedia

    en.wikipedia.org/wiki/Heat_treating

    Heat treating furnace at 1,800 °F (980 °C) Heat treating (or heat treatment) is a group of industrial, thermal and metalworking processes used to alter the physical, and sometimes chemical, properties of a material.

  9. Thermal fluctuations - Wikipedia

    en.wikipedia.org/wiki/Thermal_fluctuations

    In statistical mechanics, thermal fluctuations are random deviations of an atomic system from its average state, that occur in a system at equilibrium. [1] All thermal fluctuations become larger and more frequent as the temperature increases, and likewise they decrease as temperature approaches absolute zero .