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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
The PS3 supports both the USB EyeToy camera/webcam and SOCOM Headset for video and voice chat. A memory card adapter is available so users can copy their old PS/PS2 game saves to a virtual memory card on the PS3's hard drive. [55] The PlayStation 3 can also use Memory Sticks to store and save data for PlayStation and PlayStation 2 software. [56]
Silicone grease is widely used as a temporary sealant and a lubricant for interconnecting ground glass joints, as is typically used in laboratory glassware.Although silicones are normally assumed to be chemically inert, several historically significant compounds have resulted from unintended reactions with silicones.
Thermal spraying is a line of sight process and the bond mechanism is primarily mechanical. Thermal spray application is not compatible with the substrate if the area to which it is applied is complex or blocked by other bodies. [9]
Electrostatic coating is a manufacturing process that employs charged particles to more efficiently paint a workpiece. Paint, in the form of either powdered particles or atomized liquid, is initially projected towards a conductive workpiece using normal spraying methods, and is then accelerated toward the work piece by a powerful electrostatic charge.
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Paint protection films use by the military has continued to the present day and 3M now makes a wide variety of aerospace and military films. [3] With time, however, the automobile industry began to take note of the protective benefits of PPF and it was soon being employed by race car drivers despite the difficulty of working with the original films.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).