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2. Hybrid integrated circuit - Wikipedia

   en.wikipedia.org/wiki/Hybrid_integrated_circuit

   An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board (PCB).. A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors ...

3. Solid Logic Technology - Wikipedia

   en.wikipedia.org/wiki/Solid_Logic_Technology

   Steps in manufacturing Solid Logic Technology hybrid modules. The process starts with a blank ceramic wafer, 1 ⁄ 2 inch (13 mm) square. Circuits are laid down first, followed by resistive material. Pins are added, the circuits are soldered and the resistors trimmed to the desired value.

4. Multi-chip module - Wikipedia

   en.wikipedia.org/wiki/Multi-chip_module

   A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...

5. Thick-film technology - Wikipedia

   en.wikipedia.org/wiki/Thick-film_technology

   Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...

6. Circuit design - Wikipedia

   en.wikipedia.org/wiki/Circuit_design

   In Electrical Engineering, the process of circuit design can cover systems ranging from complex electronic systems down to the individual transistors within an integrated circuit. One person can often do the design process without needing a planned or structured design process for simple circuits.

7. Hybrid-pi model - Wikipedia

   en.wikipedia.org/wiki/Hybrid-pi_model

   Full hybrid-pi model. The full model introduces the virtual terminal, B′, so that the base spreading resistance, r bb, (the bulk resistance between the base contact and the active region of the base under the emitter) and r b′e (representing the base current required to make up for recombination of minority carriers in the base region) can be represented separately.