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2. Wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Wafer-level_packaging

   A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...

3. Microlens - Wikipedia

   en.wikipedia.org/wiki/Microlens

   A microlens array used in a spectrograph. A microlens is a small lens, generally with a diameter less than a millimetre (mm) and often as small as 10 micrometres (μm). The small sizes of the lenses means that a simple design can give good optical quality but sometimes unwanted effects arise due to optical diffraction at the small features.

4. Immersion lithography - Wikipedia

   en.wikipedia.org/wiki/Immersion_lithography

   In immersion lithography, light travels down through a system of lenses and then a pool of water before reaching the photoresist on top of the wafer.. Immersion lithography is a technique used in semiconductor manufacturing to enhance the resolution and accuracy of the lithographic process.

5. Ultra-high-purity steam for oxidation and annealing - Wikipedia

   en.wikipedia.org/wiki/Ultra-high-purity_steam...

   Immersion lithography places a layer of pure water between the projection lens and the wafer. Any contaminant within the water can lead to change in refractive index and a project defect on the wafer. Micro-bubbles in the water can also lead to project defects on the wafer. Water vapor also plays an important role in Carbon NanoTube (CNT ...

6. Fan-out wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Fan-out_wafer-level_packaging

   This is known as a chip-first flow. Panel level packaging uses a large panel instead of a wafer to carry out the packaging process. [6] High end fan-out packages are those with lines and spaces narrower than 8 microns. [4] Fan-out packages can also have several dies, [5] and passive components. [6]

7. Embedded wafer level ball grid array - Wikipedia

   en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

   Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...

8. Chemistry of photolithography - Wikipedia

   en.wikipedia.org/wiki/Chemistry_of_photolithography

   The wafer can undergo a dehydration bake to remove adsorbed water, and followed by the HMDS treatment also known as the priming stage. HMDS can be dispensed in liquid form onto the wafer using a syringe while the wafer is attached to a vacuum chuck in a spin coater .

9. Wafer bonding - Wikipedia

   en.wikipedia.org/wiki/Wafer_bonding

   Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...