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In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits. Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates.
In electronics this often is the result of components that are thermally sensitive (since resistance of a circuit varies with the temperature of the conductors in it). Compressed air can be used to cool specific spots on a circuit board and a heat gun can be used to raise the temperatures; thus troubleshooting of electronics systems frequently ...
A simple example of an effectively random cause in a physical system is a borderline electrical connection in the wiring or a component of a circuit, where (cause 1, the cause that must be identified and rectified) two conductors may touch subject to (cause 2, which need not be identified) a minor change in temperature, vibration, orientation ...
List of free analog and digital electronic circuit simulators, available for Windows, macOS, Linux, and comparing against UC Berkeley SPICE.The following table is split into two groups based on whether it has a graphical visual interface or not.
Electronic test equipment is used to create signals and capture responses from electronic devices under test (DUTs). In this way, the proper operation of the DUT can be proven or faults in the device can be traced. Use of electronic test equipment is essential to any serious work on electronics systems.
The faulted, but energized, feeder can be found with a ring-type current transformer collecting all the phase wires of the circuit; only the circuit containing a fault to ground will show a net unbalanced current. To make the ground fault current easier to detect, the grounding resistor of the system may be switched between two values so that ...
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
Glitch removal is the elimination of glitches—unnecessary signal transitions without functionality—from electronic circuits. Power dissipation of a gate occurs in two ways: static power dissipation and dynamic power dissipation. Glitch power comes under dynamic dissipation in the circuit and is directly proportional to switching activity.