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  2. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...

  3. NZXT - Wikipedia

    en.wikipedia.org/wiki/NZXT

    An NZXT X52 240mm water cooler. NZXT has multiple all-in-one water cooler products under their Kraken lineup. The first of these was released in 2013, in both 140mm and 280mm sizes. [41] [42] NZXT has since released multiple updates to this lineup, including new coolers in 120mm and 360mm sizes, and improvements to the pumps and radiators.

  4. Best CPU Coolers 2022: AIO and Air Coolers

    www.aol.com/news/best-cpu-coolers-2022-aio...

    These are the best air and liquid/AIO CPU coolers for all consumer systems, from small form-factor builds to overclocked big rigs.

  5. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  7. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...