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  2. Bootstrapping (electronics) - Wikipedia

    en.wikipedia.org/wiki/Bootstrapping_(electronics)

    The bootstrap circuit uses a coupling capacitor, formed from the gate/source capacitance of a transistor, to drive a signal line to slightly greater than the supply voltage. [10] Some all-pMOS integrated circuits such as the Intel 4004 and the Intel 8008 use that 2-transistor "bootstrap load" circuit. [11] [12] [13]

  3. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

  4. Desoldering - Wikipedia

    en.wikipedia.org/wiki/Desoldering

    Desoldering may be required to replace a defective component, to alter an existing circuit, or to salvage components for re-use. Use of too high a temperature or heating for too long may damage components or destroy the bond between a printed circuit trace and the board substrate. Techniques are different for through-hole and surface-mounted ...

  5. Automatic test pattern generation - Wikipedia

    en.wikipedia.org/wiki/Automatic_test_pattern...

    ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.

  6. PCB reverse engineering - Wikipedia

    en.wikipedia.org/wiki/PCB_reverse_engineering

    Obtaining circuit board design data is not by necessity malicious or aimed at intellectual property theft. The data generated in the reverse engineering process can be used for troubleshooting, repair, redesign and re-manufacturing, or even testing the security of a device to be used in a restricted environment. [2] [3] [4] [5]

  7. Failure of electronic components - Wikipedia

    en.wikipedia.org/wiki/Failure_of_electronic...

    These effects can occur both within packaging and on circuit boards. Formation of silicon nodules. Aluminium interconnects may be silicon-doped to saturation during deposition to prevent alloy spikes. During thermal cycling, the silicon atoms may migrate and clump together forming nodules that act as voids, increasing local resistance and ...