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Rigid cellular polystyrene (RCPS). This includes extruded polystyrene foam XPS (such as Styrofoam and commonly referred to as "blue board," expanded polystyrene foam EPS (commonly referred to as "beadboard"), and MEPS. Polyisocyanurate (also known as polyiso). More stable at high temperatures and less flammable than polyurethane.
The generalised chemical structure of polyisocyanurate showing the isocyanurate group. The polyols are abbreviated as R-groups.. Polyisocyanurate (/ ˌ p ɒ l ɪ ˌ aɪ s oʊ s aɪ ˈ æ nj ʊər eɪ t /), also referred to as PIR, polyol, or ISO, is a thermoset plastic [1] typically produced as a foam and used as rigid thermal insulation.
PVC foamboard is distinct from the extra-lightweight foamcore board, laminated of foam and card surfaces, used for indoor signage and modelling. Like PVC, closed-cell PVC foamboard is solid and has a very rigid structure. Where it differs is in its closed-cell foam structure, which makes it very light (as little as half the weight of solid PVC ...
SIP is a sandwich structured composite, consisting of an insulating layer of rigid core sandwiched between two layers of structural board. The board can be sheet metal , fibre cement , magnesium oxide board (MgO), plywood or oriented strand board (OSB), and the core can either be expanded polystyrene foam (EPS), extruded polystyrene foam (XPS ...
Industrial Insulation. Rigid polyurethane foam is used in various industries to provide thermal insulation to installations and pipes. In particular, the piping for district heating systems in Europe is primarily insulated using a pre-insulated pipes sandwich assembly composed of a steel heat service pipe, an insulating layer (polyurethane foam) and a polyethylene (PE) casing, which are bonded ...
Rigid panel insulation, also known as continuous insulation [13] can be made from foam plastics such as polyisocyanurate or polystyrene, or from fibrous materials such as fiberglass, rock and slag wool. Rigid panel continuous insulation is often used to provide a thermal break in the building envelope, thus reducing thermal bridging.