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Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package
The standard [2] includes multiple package variants: [3] [4] DO-214AA, also known as SMB, [5] is the middle size. DO-214AB, also known as SMC, [6] is the largest size.
Size comparison of transistor packages. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [1]
This yields an IC package with a significant reduction in the size compared to standard package. All IC assembly processes remain the same as with standard SOPs. Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and mass.
SOD-123 package. Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes. The standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923. [1] SOD-123 is the largest, SOD-923 is the smallest.
The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead. Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison.
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