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Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...
Hard chrome plating. Hard chrome, also known as industrial chrome or engineered chrome, is used to reduce friction, improve durability through abrasion tolerance and wear resistance in general, minimize galling or seizing of parts, expand chemical inertness to include a broader set of conditions (such as oxidation resistance), and bulking ...
Immersion zinc plating is an electroless (non-electrolytic) coating process that deposits a thin layer of zinc on a less electronegative metal, by immersion in a solution containing a zinc or zincate ions, Zn(OH) 2− 4. A typical use is plating aluminum with zinc prior to electrolytic or electroless nickel plating.
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [ 16 ] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.
In 1932, Lewis T. Briggs Sr., a part-owner of the Erie Bronze Company, bought out Smith's co-investors and became president of the eight-person company. During World War II the Erie Plating Company expanded into plating military components. The main wartime products produced in Erie were bomb fuses, aircraft parts, and communication equipment.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .