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  2. Universal Flash Storage - Wikipedia

    en.wikipedia.org/wiki/Universal_Flash_Storage

    On 30 January 2018 JEDEC published version 3.0 of the UFS standard, with a higher 11.6 Gbit/s data rate per lane (1450 MB/s) with the use of MIPI M-PHY v4.1 and UniProSM v1.8. At the MWC 2018, Samsung unveiled embedded UFS (eUFS) v3.0 and uMCP (UFS-based multi-chip package ) solutions.

  3. Replay Protected Memory Block - Wikipedia

    en.wikipedia.org/wiki/Replay_Protected_Memory_Block

    The UFS specification allocates a "Well-Known LUN" identifier of 44h for the RPMB device. [1] This can be represented as: UFS LUN: WLUN_ID (80h) | UNIT_NUMBER_ID = C4h 64-bit SCSI LUN: WLUN_ID (C1h) | UNIT_NUMBER_ID = C1h 44h 00h 00h 00h 00h 00h 00h

  4. UniPro - Wikipedia

    en.wikipedia.org/wiki/UniPro

    On January 30, 2018, JEDEC published the UFS 3.0 standard which uses MIPI M-PHY v4.1 (with HS-Gear4) and MIPI UniPro v1.8 for mobile memory with data rates up to 2900 MB/s (11,6 Gbit/s per lane, 2 lanes, 23,2 Gbit/s total).

  5. Samsung Galaxy S23 - Wikipedia

    en.wikipedia.org/wiki/Samsung_Galaxy_S23

    The 128 GB versions of the Galaxy S23 and Galaxy S23 FE use the older UFS 3.1 storage format, while versions with 256 GB and more use the newer, faster and more efficient UFS 4.0. [ 16 ] [ 17 ] Models

  6. MultiMediaCard - Wikipedia

    en.wikipedia.org/wiki/MultiMediaCard

    JEDEC is an organization devoted to standards for the solid-state industry. The latest eMMC specifications can be requested from JEDEC, free-of-charge for JEDEC members. [ 7 ] Older versions of the standard are freely available, but some optional enhancements to the standard such as MiCard and SecureMMC specifications, must be purchased separately.

  7. M-PHY - Wikipedia

    en.wikipedia.org/wiki/M-PHY

    M-PHY (like its predecessor [dubious – discuss] D-PHY) is intended to be used in high-speed point-to-point communications, for example video Camera Serial Interfaces.The CSI-2 interface was based on D-PHY (or C-PHY), while the newer CSI-3 interface is based on M-PHY.

  8. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    JEDEC JEP95 official list of all (over 500) standard electronic packages; Fairchild Index of Package Information; An illustrated listing of different package types, with links to typical dimensions/features of each; Intersil packaging information; ICpackage.org; Solder Pad Layout Dimensions; International Microelectronics And Packaging Society

  9. Sony Xperia 1 III - Wikipedia

    en.wikipedia.org/wiki/Sony_Xperia_1_III

    Universal Flash Storage (UFS 3.X) 256 GB (SO-51B, SOG03 and A101SO models) 512 GB (XQ-BC42 model) Removable storage: ... Specifications. Hardware