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  2. Mobvoi - Wikipedia

    en.wikipedia.org/wiki/Mobvoi

    The TicWatch Pro 3 GPS [34] was launched in September 2020. It is the second watch in Mobvoi's Pro lineup, the TicWatch Pro (2020) being the first. It operates on Google's Wear OS, just like the previous smartwatches from Mobvoi. [35] The TicWatch Pro 3 GPS is the first Wear OS watch to use Qualcomm's Snapdragon Wear 4100 chipset. [36]

  3. List of Wear OS devices - Wikipedia

    en.wikipedia.org/wiki/List_of_Wear_OS_devices

    Mobvoi: TicWatch S & E: 2018-01 Wear OS 2.24 8.0.0 MTK MT2601: 512 MB No 300 mAh 1.4 inch OLED display, 400x400, 287dpi $159.99 (E) $199 (S) IP67 [42] TicWatch C2: 2018-05 Wear OS 2.24 H MR1 (Android 9.0.0) Qualcomm Snapdragon Wear 2100 512 MB No 400 mAh $249.99 IP68 Microphone and speaker TicWatch Pro: 2018-07-10 Wear OS 2.24 H MR1 (Android 9.0.0)

  4. List of NFC-enabled mobile devices - Wikipedia

    en.wikipedia.org/wiki/List_of_NFC-enabled_mobile...

    Mobvoi: Ticwatch C2 - 18mm 9 (H) 2018 - December Ticwatch C2 - 20mm 9 (H) 2018 - December Ticwatch Pro 9 (H) 2018 - July Ticwatch Pro 4G/LTE 9 (H) 2019 - July Montblanc: Summit 2 9 (H) 2018 - October Motorola: Moto 360 (Gen 3) 9 (H) Unreleased: Movado: Connect 9 (H) 2017 - August Connect 2.0 42mm 9 (H) 2019 - September Connect 2.0 40mm 9 (H ...

  5. Wear OS - Wikipedia

    en.wikipedia.org/wiki/Wear_OS

    Azərbaycan - Azerbaijani Bosanski - Bosnian Català - Catalan Čeština - Czech Dansk - Danish Deutsch (Deutschland) - German (Germany) Deutsch (Österreich ...

  6. Guoxin Micro - Wikipedia

    en.wikipedia.org/wiki/Guoxin_Micro

    The predecessor of Guoxin Micro was Tangshan Jingyuan Yufeng Electronics which was established in 1991. In August 2001, it completed completed its restructuring to become a joint-stock company.

  7. Wingtech - Wikipedia

    en.wikipedia.org/wiki/Wingtech

    The company was founded as original design manufacturer in 2006 by a former STMicroelectronics engineer, Zhang Xuezheng. [4] Wingtech's main business includes semiconductor chip design, wafer manufacturing, optical imaging and communication product integration. [5]