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  2. Curing (chemistry) - Wikipedia

    en.wikipedia.org/wiki/Curing_(chemistry)

    Curing is a chemical process employed in polymer chemistry and process engineering that produces the toughening or hardening of a polymer material by cross-linking of polymer chains. [1] Even if it is strongly associated with the production of thermosetting polymers , the term "curing" can be used for all the processes where a solid product is ...

  3. Epoxy molding compounds - Wikipedia

    en.wikipedia.org/wiki/Epoxy_Molding_Compounds

    Epoxy encapsulation materials are a type of highly filled particulate polymer composite, comprising various components to meet the requirements for reliability, physical properties, and moldability. These components include silica , epoxy resin , hardeners, flame retardants , catalysts , and stress-relaxation additives .

  4. Epoxy - Wikipedia

    en.wikipedia.org/wiki/Epoxy

    These highly viscous to solid resins typically carry 2 to 6 epoxy groups per molecule. By curing, highly cross-linked polymers with high temperature and chemical resistance but low mechanical flexibility are formed due to the high functionality, and hence high crosslink density of these resins. [13]

  5. Thermosetting polymer - Wikipedia

    en.wikipedia.org/wiki/Thermosetting_polymer

    In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer . [1] Curing is induced by heat or suitable radiation and may be promoted by high pressure or mixing with a catalyst .

  6. SU-8 photoresist - Wikipedia

    en.wikipedia.org/wiki/SU-8_photoresist

    The exposure time is a function of exposure dose and film thickness. After exposure the SU-8 needs to be baked again to complete the polymerization. This baking step is not as critical as the prebake but the rising of the temperature (again to 95 °C) needs to be slow and controlled. At this point the resist is ready to be developed.

  7. B-staging - Wikipedia

    en.wikipedia.org/wiki/B-staging

    In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance. Attempts to use traditional epoxies in IC packaging often created expensive production bottlenecks, because, as soon as the epoxy adhesive was applied, the components had to be assembled and cured immediately. B ...

  8. Polybenzoxazine - Wikipedia

    en.wikipedia.org/wiki/Polybenzoxazine

    The result of heating up benzoxazine monomers is a high molecular weight thermoset polymer matrix. Composites of it are used where enhanced mechanical performance, flame and fire resistance compared to epoxy and phenolic resins is required. [2] Polybenzoxazines are a class of halogen-free high-performance polymers.

  9. List of abbreviations used in medical prescriptions - Wikipedia

    en.wikipedia.org/wiki/List_of_abbreviations_used...

    This is a list of abbreviations used in medical prescriptions, including hospital orders (the patient-directed part of which is referred to as sig codes).This list does not include abbreviations for pharmaceuticals or drug name suffixes such as CD, CR, ER, XT (See Time release technology § List of abbreviations for those).