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  2. Freezer (computer cooling) - Wikipedia

    en.wikipedia.org/wiki/Freezer_(computer_cooling)

    To most enthusiasts, Arctic is best known for their Freezer line of CPU coolers as well as their thermal compound called MX-2 and MX-4. [2] The Freezer line of coolers is available in different fan speed, cooling capacity and motherboard compatibility [ 3 ] to cater the needs of different type of users from HTPC users to enthusiasts and ...

  3. LGA 1700 - Wikipedia

    en.wikipedia.org/wiki/LGA_1700

    Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink ...

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...

  5. Best CPU Coolers 2022: AIO and Air Coolers

    www.aol.com/news/best-cpu-coolers-2022-aio...

    These are the best air and liquid/AIO CPU coolers for all consumer systems, from small form-factor builds to overclocked big rigs.

  6. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  8. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

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