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PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.
When vias with a diameter smaller than 76.2 micrometers are required, drilling with mechanical bits is impossible because of high rates of wear and breakage. In this case, the vias may be laser drilled—evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
A via fence consists of a row of via holes, that is, holes that pass through the substrate and are metallised on the inside to connect to pads on the top and bottom of the substrate. In a stripline format both the top and bottom of the dielectric sheet are covered with a metal ground plane so any via holes are automatically grounded at both ends.
Classical printed circuit board (PCB) material can be used (this method is typically used with through-hole technology components). This is also true for low-power applications (from some milliwatts to some watts), as the PCB can be thermally enhanced by using thermal vias or wide tracks to improve convection. An advantage of this method is ...
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