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2. 4 BAZAAR Beauty Editors Try La Mer's The Micro Peel - AOL

   www.aol.com/4-bazaar-beauty-editors-tried...

   According to BAZAAR editors, The Micro Peel is worth the buy, although it may be pricey for some beauty enthusiasts. Its mild yet effective formula seamlessly works on a number of skin types ...

3. Dermabrasion - Wikipedia

   en.wikipedia.org/wiki/Dermabrasion

   Dermabrasion is currently rarely practiced and there are very few doctors who are trained and still perform this surgery. Dermabrasion has largely been replaced by technologies including lasers, CO 2 or Erbium:YAG laser. Laser technologies carry the advantage of little to no bleeding and are often less operator dependent than dermabrasion.

4. Nanolaser - Wikipedia

   en.wikipedia.org/wiki/Nanolaser

   SEM image of microdisk laser with a whispering-gallery mode resonator. [25] A microdisk laser is a very small laser consisting of a disk with quantum well structures built into it. Its dimensions can exist on the micro-scale or nano-scale. Microdisk lasers use a whispering-gallery mode resonant cavity.

5. Laser peening - Wikipedia

   en.wikipedia.org/wiki/Laser_peening

   Laser peening (LP), or laser shock peening (LSP), is a surface engineering process used to impart beneficial residual stresses in materials. The deep, high-magnitude compressive residual stresses induced by laser peening increase the resistance of materials to surface-related failures, such as fatigue, fretting fatigue, and stress corrosion cracking.

6. The 100 best moisturizers tested and ranked, according to editors

   www.aol.com/news/100-best-moisturizers-tested...

   Olay Micro-Sculpting Cream $ at Ulta. ... dry skin frequently flakes and peels, so I flock to super-thick creams. ... FAAD is a board-certified dermatologist and owner of The Dermatology and Laser ...

7. Lift-off (microtechnology) - Wikipedia

   en.wikipedia.org/wiki/Lift-off_(microtechnology)

   The lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e.g. wafer) using a sacrificial material (e.g. photoresist).