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  2. Level sensor - Wikipedia

    en.wikipedia.org/wiki/Level_sensor

    The vibration of the probe tends to eliminate build-up of material on the probe element. Vibrating level sensors are not affected by dust, static charge build-up from dielectric powders, or changes in conductivity, temperature, pressure, humidity or moisture content. Tuning-fork style vibration sensors are another alternative.

  3. Tuning fork - Wikipedia

    en.wikipedia.org/wiki/Tuning_fork

    A tuning fork is a fork-shaped acoustic resonator used in many applications to produce a fixed tone. The main reason for using the fork shape is that, unlike many other types of resonators, it produces a very pure tone, with most of the vibrational energy at the fundamental frequency. The reason for this is that the frequency of the first ...

  4. Non-contact atomic force microscopy - Wikipedia

    en.wikipedia.org/wiki/Non-contact_atomic_force...

    Schematic of qPlus sensor. Red and blue areas represent the two gold electrodes on the quartz tuning fork (light yellow). A qPlus sensor is used in many ultra-high vacuum nc-AFMs. The sensor was originally made from a quartz tuning fork from a wristwatch. In contrast to a quartz tuning fork sensor that consists of two coupled tines that ...

  5. Vibrating structure gyroscope - Wikipedia

    en.wikipedia.org/wiki/Vibrating_structure_gyroscope

    Vibrating structure gyroscope. A vibrating structure gyroscope (VSG), defined by the IEEE as a Coriolis vibratory gyroscope (CVG), [1] is a gyroscope that uses a vibrating structure to determine the rate of rotation. A vibrating structure gyroscope functions much like the halteres of flies (insects in the order Diptera).

  6. Yaw-rate sensor - Wikipedia

    en.wikipedia.org/wiki/Yaw-rate_sensor

    A yaw-rate sensor is a gyroscopic device that measures a vehicle's yaw rate, its angular velocity around its vertical axis. The angle between the vehicle's heading and velocity is called its slip angle , which is related to the yaw rate.

  7. Microelectromechanical system oscillator - Wikipedia

    en.wikipedia.org/wiki/Microelectromechanical...

    The completed MEMS devices, enclosed in small chip-level vacuum chambers, are diced from their silicon wafers, and the resonator die are stacked on CMOS die and molded into plastic packages to form oscillators. MEMS oscillators are packaged in the same factories and with the same equipment and materials that are used for standard IC packaging.

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