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Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
Bottom right: completed solar wafers. In electronics, a wafer (also called a slice or substrate) [ 1 ] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices ...
Semiconductor device manufacturing has since spread from Texas and California in the 1960s to the rest of the world, including Asia, Europe, and the Middle East. Wafer size has grown over time, from 25 mm in 1960, to 50 mm in 1969, 100 mm in 1976, 125 mm in 1981, 150 mm in 1983 and 200 mm in 1992. [41] [42]
An epitaxial wafer[1] (also called epi wafer, [2] epi-wafer, [3] or epiwafer[4]) is a wafer of semiconducting material made by epitaxial growth (epitaxy) for use in photonics, microelectronics, spintronics, or photovoltaics. The epi layer may be the same material as the substrate, typically monocrystaline silicon, or it may be a silicon dioxide ...
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography.
A process design kit (PDK) is a set of files used within the semiconductor industry to model a fabrication process for the design tools used to design an integrated circuit. The PDK is created by the foundry defining a certain technology variation for their processes. It is then passed to their customers to use in the design process.
Process corners. In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that ...
Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed before a wafer is sent to die preparation , all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them.