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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F). Extra-hard solder has 80% silver and melts at 740 °C (1,370 °F). If multiple joints are needed, then the jeweler will start with hard or extra-hard solder and switch to lower-temperature solders for later joints. Silver solder is somewhat absorbed by the ...
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.
For example, tin-lead solder [5] attaches very well to copper metal, but poorly to its oxides, which form quickly at soldering temperatures. By preventing the formation of metal oxides, flux enables the solder to adhere to the clean metal surface, rather than forming beads, as it would on an oxidized surface.
Silver brazing may cause defects in certain alloys, e.g. stress-induced inter-granular cracking in copper-nickel. One special silver brazing method is called pinbrazing or pin brazing. It has been developed especially for connecting cables to railway track or for cathodic protection installations. The method uses a silver- and flux-containing ...