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LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
[1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...
TO-252, also known as DPAK [1] or Decawatt Package, is a semiconductor package developed by Motorola [2] for surface mounting on circuit boards. [3] It represents a surface-mount [4] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.
It is possible to use Socket 7 processors in a Socket 5. An adapter is required, or if one is careful, a socket 7 can be pulled off its pins and put onto a socket 5 board, allowing the use of socket 7 processors. Socket 8: 1995 Intel Pentium Pro: PGA: 387 ? 60–66 MHz Slot 1: 1997 Intel Pentium II Intel Pentium III: Desktop Slot: 242 ? 66 ...
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [ 2 ] [ 3 ] AM5 was launched in September 2022 and is the successor to AM4 .