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  2. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Wafer carriers or cassettes, which can hold several wafers at once, were developed to carry several wafers between process steps, but wafers had to be individually removed from the carrier, processed and returned to the carrier, so acid-resistant carriers were developed to eliminate this time consuming process, so the entire cassette with ...

  3. Disodium pyrophosphate - Wikipedia

    en.wikipedia.org/wiki/Disodium_pyrophosphate

    It is an acid source for reaction with baking soda to leaven baked goods. [4] In baking powder, it is often labeled as food additive E450. [ 5 ] In cured meats , it speeds the conversion of sodium nitrite to nitrite ( NO − 2 ) by forming the nitrous acid (HONO) intermediate, [ clarification needed ] and can improve water-holding capacity.

  4. Sodium bicarbonate - Wikipedia

    en.wikipedia.org/wiki/Sodium_bicarbonate

    Cupcakes baked with baking soda as a raising agent. Sodium bicarbonate (IUPAC name: sodium hydrogencarbonate [9]), commonly known as baking soda or bicarbonate of soda, is a chemical compound with the formula NaHCO 3. It is a salt composed of a sodium cation (Na +) and a bicarbonate anion (HCO 3 −).

  5. What Happens If You Accidentally Swap Baking Soda & Baking ...

    www.aol.com/happens-accidentally-swap-baking...

    Just like baking soda and vinegar simulate a volcanic eruption, baking soda interacts with acidic ingredients in doughs and batters to create bubbles of CO 2. But instead of spilling out of a ...

  6. What's the difference between baking soda and baking powder?

    www.aol.com/2017-03-23-difference-baking-soda...

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  7. What's the Difference Between Baking Soda and Baking Powder?

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    Here's the answer, once and for all. For premium support please call: 800-290-4726 more ways to reach us

  8. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board , via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical ...

  9. What's the difference between baking soda and baking powder?

    www.aol.com/article/lifestyle/2017/03/23/...

    If you're attempting to create your own recipe, Jaffe says the general ratio for baking soda is about ¼ teaspoon per cup of flour, and for baking powder it's a bit more—1 teaspoon per 1 cup of ...