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  2. Chipseal - Wikipedia

    en.wikipedia.org/wiki/Chipseal

    Chip seal products can be installed over gravel roads to eliminate the cost of grading, road roughness, dust, mud, and the cost of adding gravel lost from grading. Adding chip seal over gravel is about 25% of the price of resurfacing with asphalt, $170,000 for a 4-mile project done in Minnesota [6] compared to $760,000 had it been redone with ...

  3. Otta seal - Wikipedia

    en.wikipedia.org/wiki/Otta_seal

    Otta seal is considered to be a low cost seal. With its low initial cost and less demanding maintenance, it is a very cheap alternative for road surfaces. The cost for a double layer Otta seal is about US $2.00 to US $2.70 per square meter (US $2.40 to US $3.25 per square yard) and will last from 8 to 15 years.

  4. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    Fan.out packages are used in cases where fan-in packages are not able to provide enough connections at a specified cost. [ 9 ] In February 2015, it was discovered that a WL-CSP chip in the Raspberry Pi 2 had issues with xenon flashes (or any other bright flashes of longwave light), inducing the photoelectric effect within the chip. [ 10 ]

  5. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    For example, in a chip-on-board assembly process, a silicon die is mounted on the board with an adhesive or soldering process, and then it is electrically connected by wire bonding, typically with 25.4 μm diameter gold or aluminum wire. The chip and the wire are delicate, so they are encapsulated in a version of the conformal coating called a ...

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  7. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    Other application areas are space electronics, consumer electronics, and various measurement systems where low cost and/or high reliability is needed. The simplest form to utilise a thick film technology is a module substrate/board, where wiring is manufactured using thick film process.