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  2. Stencil printing - Wikipedia

    en.wikipedia.org/wiki/Stencil_Printing

    The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process. Actual stencil life for a paste should be determined from the manufacturers' specifications and on-site verification.

  3. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Some key QFN design considerations are pad and stencil design. When it comes to bond pad design two approaches can be taken: solder mask defined (SMD) or non-solder mask defined (NSMD). A NSMD approach typically leads to more reliable joints, since the solder is able to bond to both the top and sides of the copper pad. [ 4 ]

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  5. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand.

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    TO-262: [24] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting; TO-263: [24] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole; TO-274: [24] Also called Super-247: SMT package similar to the TO-247 without the mounting hole

  7. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    Screen-printing is the process of transferring an ink through a patterned woven mesh screen or stencil using a squeegee. [8] For improving accuracy, increasing integration density and improving line and space accuracy of traditional screen-printing photoimageable thick-film technology has been developed. Use of these materials however changes ...

  8. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Internal details of a two head, gantry style pick-and-place JUKI SMT machine. In the foreground are tape and reel feeders, then the (currently empty) conveyor belt for printed circuit boards, and in back are large parts in a tray. The gantry carries two pickup nozzles, flanking a camera (marked "do not touch" to avoid fingerprints on the lens).

  9. File:SMT sizes, based on original by Zureks.svg - Wikipedia

    en.wikipedia.org/wiki/File:SMT_sizes,_based_on...

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