Ads
related to: sn pb solder
Search results
Results From The WOW.Com Content Network
Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0.04: 183 ...
Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Bi 52.5, Pb 32.0, Sn 15.5: 95 °C (203 °F) yes Bi 52, Pb 32.0, Sn 16: 96 °C (205 °F) yes: Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [10] Bi 50.0, Pb 31.2, Sn 18.8: 97 °C (207 ...
Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.
Tin has long been used in alloys with lead as solder, in amounts of 5 to 70% w/w. Tin with lead forms a eutectic mixture at the weight proportion of 61.9% tin and 38.1% lead (the atomic proportion: 73.9% tin and 26.1% lead), with melting temperature of 183 °C (361.4 °F).