When.com Web Search

  1. Ads

    related to: heat sink calculation for mosfet circuit panel replacement cost

Search results

  1. Results From The WOW.Com Content Network
  2. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Aluminum is also much lighter than copper, offering less mechanical stress on delicate electronic components. Some heat sinks made from aluminum have a copper core as a trade off. The heat sink's contact surface (the base) must be flat and smooth to ensure the best thermal contact with the object needing cooling.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  4. Thermal simulations for integrated circuits - Wikipedia

    en.wikipedia.org/wiki/Thermal_simulations_for...

    Temperature increase becomes relevant for relatively small-cross-sections wires, where it may affect normal semiconductor behavior. Besides, since the generation of heat is proportional to the frequency of operation for switching circuits, fast computers have larger heat generation than slow ones, an undesired effect for chips manufacturers.

  5. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab with a hole used to mount the component to a heat sink. Thermal compound is often applied between package and heatsink to further improve heat transfer.

  6. Active rectification - Wikipedia

    en.wikipedia.org/wiki/Active_rectification

    Using these ideal diodes rather than standard diodes for solar electric panel bypass, reverse-battery protection, or bridge rectifiers reduces the amount of power dissipated in the diodes, improving efficiency and reducing the size of the circuit board and the weight of the heat sink required to deal with the power dissipation.

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Pd = Thermal power generated by a CPU and to be dissipated into the ambient through a suitable Heat sink. It corresponds to the total power drain from the direct current supply rails of the CPU. Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air.