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Several variants of the original TO-5 package have the same cap dimensions but differ in the number and length of the leads (wires). Somewhat incorrectly, TO-5 and TO-39 are often used in manufacturer's literature as synonyms for any package with the cap dimensions of TO-5, regardless of the number of leads, or even for any package with the diameter of TO-5, regardless of the cap height and ...
Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3] TSOP: Thin small-outline package [3] TSSOP
Size comparison between (left to right) TO-8, TO-5 and TO-18 packages The typical TO-8 metal can package has a base diameter of 15.24 mm (0.600 in), a cap diameter of 12.29 mm (0.484 in), and a cap height of 7.62 mm (0.300 in). [1]
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
[1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...
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Cross section of 2N2222 transistor in metal TO-18 package, showing connection wires between external pins and die. Size comparison between (left to right) TO-39, TO-18, and TO-92 packages. In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package.