When.com Web Search

  1. Ads

    related to: cpu thermal output

Search results

  1. Results From The WOW.Com Content Network
  2. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    Datasheets normally contain the thermal design power (TDP), which is the maximum amount of heat generated by the CPU, which the cooling system in a computer is required to dissipate. Both Intel and Advanced Micro Devices (AMD) have defined TDP as the maximum heat generation for thermally significant periods, while running worst-case non ...

  3. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).

  5. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]

  6. Dynamic frequency scaling - Wikipedia

    en.wikipedia.org/wiki/Dynamic_frequency_scaling

    Dynamic frequency scaling (also known as CPU throttling) is a power management technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip.

  7. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  8. CPU core voltage - Wikipedia

    en.wikipedia.org/wiki/CPU_core_voltage

    The CPU core voltage (V CORE) is the power supply voltage supplied to the processing cores of CPU (which is a digital circuit), GPU, or any other device with a processing core. The amount of power a CPU uses, and thus the amount of heat it dissipates, is the product of this voltage and the current it draws.

  9. Computer fan control - Wikipedia

    en.wikipedia.org/wiki/Computer_fan_control

    Full-tower computer cases may contain multiple cooling fans. At the top of the case is a fan controller. Fan control is the management of the rotational speed of an electric fan. In computers, various types of computer fans are used to provide adequate cooling, and different fan control mechanisms balance their cooling capacities and noise they ...