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Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Matrix is the company's most recent thermal compound in collaboration with TIM Consultants. [6] It consists of a silicone oil base containing aluminum, aluminum oxide, and zinc oxide particles. The 2009 BenchmarkReviews.com 80-product review gave Matrix (Labeled TIM Consultants T-C Grease 0098 ) an A, "enthusiast grade"; [ 2 ] it cooled a test ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
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Aluminum is the most commonly chosen encapsulant for its strength, low mass, cost, manufacturability, and thermal conductivity. Since APG's conductivity is much lower through its thickness, thermal vias are sometimes inserted into the assembly to transfer heat into the graphite, as shown in Figure 1. These vias are typically composed of ...