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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface ...
A thin layer of non-ferromagnetic material is applied to the reed switch contact area to serve as an electrical contact switching (wear) surface and, for normally-open contacts, as a magnetic spacer whose thickness is important in controlling the magnetic field level at which the contact opens (the drop-out).
On phones, the Samsung Pay menu is launched by swiping from the bottom of the screen. Different credit, debit and loyalty cards can be loaded into the app, and selected by swiping between them on-screen. [4] In South Korea, Samsung Pay can be used for online payments [5] and to withdraw money on selected banks' ATMs. [6]
Logo used until 2015. Samsung Galaxy (Korean: 삼성 갤럭시; stylized as SΛMSUNG Galaxy since 2015 (except Japan where it omitted the Samsung branding up until 2023), [2] previously stylized as Samsung GALAXY; abbreviated as SG) is a series of computing, Android mobile computing and wearable devices that are designed, manufactured and marketed by Samsung Electronics since 29 June 2009.
A PLCC circuit may either be installed in a PLCC socket or surface-mounted. PLCC sockets may in turn be surface mounted, or use through-hole technology. The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the reflow process, or to allow for component replacement ...