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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...

  3. Thermalright Reveals AMD AM5 2-in-1 Secure Frame and Thermal ...

    www.aol.com/thermalright-reveals-amd-am5-2...

    If you own a Ryzen 7000 CPU and are envious of the support frames marketed at LGA1700 users this may appeal. It's also designed to obstruct any flow of thermal grease into your processor notches.

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).

  5. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.

  6. Socket AM5 - Wikipedia

    en.wikipedia.org/wiki/Socket_AM5

    Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [ 2 ] [ 3 ] AM5 was launched in September 2022 and is the successor to AM4 .

  7. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.