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  2. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    For a peel ply, a thin, woven piece of material is applied to the adherend during fabrication. [9] Because the material is woven, it will leave a torturous surface when removed, which will improve bonding by mechanical interlocking. [6] Prior to adhesive bonding, the woven material acts to protect the surface of the adherend from contaminates.

  3. Elevate (brand) - Wikipedia

    en.wikipedia.org/wiki/Elevate_(brand)

    Elevate, formerly Firestone Building Products, is a brand of roofing, wall and lining solutions of the Holcim Group, one of the world's largest building materials manufacturing company. Elevate operates 21 manufacturing facilities in North America and produces singleply and asphalt–based roofing membranes, polyiso insulation, and roofing ...

  4. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  5. Thermal spraying - Wikipedia

    en.wikipedia.org/wiki/Thermal_spraying

    The PTWA thermal spray process utilizes a single wire as the feedstock material. All conductive wires up to and including 0.0625" (1.6mm) can be used as feedstock material, including "cored" wires. PTWA can be used to apply a coating to the wear surface of engine or transmission components to replace a bushing or bearing.

  6. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld is a two-part epoxy adhesive (or filler) that can withstand high-temperature environments. J-B Weld can be used to bond surfaces made from metal, porcelain, ceramic, glass, marble, PVC, ABS, concrete, fiberglass, wood, fabric, or paper. [7] [8] Alcohol should be avoided when cleaning surfaces, as it can degrade the bond. [9]

  7. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. [2]

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