When.com Web Search

Search results

  1. Results From The WOW.Com Content Network
  2. Failure modes, effects, and diagnostic analysis - Wikipedia

    en.wikipedia.org/wiki/Failure_Modes,_Effects...

    Under the functional failure mode approach, the actual functional failure modes of the product are identified during a DFMEA. During the detailed FMEDA, each component failure mode is mapped to a functional failure mode. The functional failure modes are then categorized according to product failure mode in a particular application. [13]

  3. Failure mode and effects analysis - Wikipedia

    en.wikipedia.org/wiki/Failure_mode_and_effects...

    Failure mode and effects analysis (FMEA; often written with "failure modes" in plural) is the process of reviewing as many components, assemblies, and subsystems as possible to identify potential failure modes in a system and their causes and effects. For each component, the failure modes and their resulting effects on the rest of the system ...

  4. File:Methods of testing thermocouples and thermocouple ...

    en.wikipedia.org/wiki/File:Methods_of_testing...

    Main page; Contents; Current events; Random article; About Wikipedia; Contact us; Donate

  5. Failure mode, effects, and criticality analysis - Wikipedia

    en.wikipedia.org/wiki/Failure_Mode,_Effects,_and...

    The failure mode may then be charted on a criticality matrix using severity code as one axis and probability level code as the other. For quantitative assessment, modal criticality number is calculated for each failure mode of each item, and item criticality number is calculated for each item. The criticality numbers are computed using the ...

  6. images.huffingtonpost.com

    images.huffingtonpost.com/2012-08-30-3258_001.pdf

    Created Date: 8/30/2012 4:52:52 PM

  7. Failure of electronic components - Wikipedia

    en.wikipedia.org/wiki/Failure_of_electronic...

    The best place to start is with the failure mode. This is based on the assumption that there is a particular failure mode, or range of modes, that may occur within a product. It is therefore reasonable to assume that the bond test should replicate the mode, or modes of interest. However, exact replication is not always possible.

  8. Time-dependent gate oxide breakdown - Wikipedia

    en.wikipedia.org/wiki/Time-dependent_gate_oxide...

    Time-dependent gate oxide breakdown (or time-dependent dielectric breakdown, TDDB) is a kind of transistor aging, a failure mechanism in MOSFETs, when the gate oxide breaks down as a result of long-time application of relatively low electric field (as opposed to immediate breakdown, which is caused by strong electric field).

  9. Failure cause - Wikipedia

    en.wikipedia.org/wiki/Failure_cause

    A part failure mode is the way in which a component failed "functionally" on the component level. Often a part has only a few failure modes. For example, a relay may fail to open or close contacts on demand. The failure mechanism that caused this can be of many different kinds, and often multiple factors play a role at the same time.