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The USB 3.1 specification takes over the existing USB 3.0's SuperSpeed USB transfer rate, now referred to as USB 3.1 Gen 1, and introduces a faster transfer rate called SuperSpeed USB 10 Gbps, corresponding to operation mode USB 3.1 Gen 2, [62] putting it on par with a single first-generation Thunderbolt channel.
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
However, the SuperSpeed USB part of the system still implements the one-lane Gen 1×1 operation mode. Therefore, two-lane operations, namely USB 3.2 Gen 1×2 (10 Gbit/s) and Gen 2×2 (20 Gbit/s), are only possible with Full-Featured USB-C. As of 2023, they are somewhat rarely implemented; Intel, however, started to include them in its 11th ...
For example, a USB 2 PCIe host controller card that presents 4 USB "Standard A" connectors typically presents one 4-port EHCI and two 2-port OHCI controllers to system software. When a high-speed USB device is attached to any of the 4 connectors, the device is managed through one of the 4 root hub ports of the EHCI controller.
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [42] to 21.5 V with USB PD 2.0 [43] and 50.9 V with USB PD 3.1, [43] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
USB 3.0 SuperSpeed and USB 2.0 High-Speed versions defined USB 3.0 SuperSpeed – host controller (xHCI) hardware support, no software overhead for out-of-order commands; USB 2.0 High-speed – enables command queuing in USB 2.0 drives; Streams were added to the USB 3.0 SuperSpeed protocol for supporting UAS out-of-order completions