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  2. Metallic bonding - Wikipedia

    en.wikipedia.org/wiki/Metallic_bonding

    The strong bonding of metals in liquid form demonstrates that the energy of a metallic bond is not highly dependent on the direction of the bond; this lack of bond directionality is a direct consequence of electron delocalization, and is best understood in contrast to the directional bonding of covalent bonds.

  3. Bonding in solids - Wikipedia

    en.wikipedia.org/wiki/Bonding_in_solids

    Weak inter molecular bonding, which forms molecular solids (sometimes anomalously called "covalent solids") Typical members of these classes have distinctive electron distributions, [2] thermodynamic, electronic, and mechanical properties. In particular, the binding energies of these interactions vary widely. Bonding in solids can be of mixed ...

  4. Adhesive bonding in structural steel applications - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_in...

    Engineers that rely heavily in the AISC manual for steel construction and AWS D1.1 for guidance have found out that the word “adhesive” appears only three times in the 604-page long AWS D1.1/D1.1M:2015 Structural Welding Code – Steel and only as part of the title of a reference standard (AWS A3.0, Standard Welding Terms and Definitions ...

  5. Adhesion - Wikipedia

    en.wikipedia.org/wiki/Adhesion

    A weaker bond is formed if a hydrogen atom in one molecule is attracted to an atom of nitrogen, oxygen, or fluorine in another molecule, a phenomenon called hydrogen bonding. Chemical adhesion occurs when the surface atoms of two separate surfaces form ionic, covalent, or hydrogen bonds. The engineering principle behind chemical adhesion in ...

  6. Substrate (materials science) - Wikipedia

    en.wikipedia.org/wiki/Substrate_(materials_science)

    Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. Surfaces have different uses, including producing new film or layers of material and being a base to which another substance is bonded.

  7. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of ...

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  9. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    Diffusion bonding involves no liquid fusion, and often no filler metal. No weight is added to the total, and the join tends to exhibit both the strength and temperature resistance of the base metal(s). The materials endure no, or very little, plastic deformation. Very little residual stress is introduced, and there is no contamination from the ...