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The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.
Interfacial thermal resistance is a measure of an interface's resistance to thermal flow. This thermal resistance differs from contact resistance, as it exists even at atomically perfect interfaces. Understanding the thermal resistance at the interface between two materials is of primary significance in the study of its thermal properties.
The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance.
So that practical clothing may be described conveniently by a range of small integers, the unit of thermal resistance, to be called the “tog”, is the resistance that will maintain a temperature difference of 0.1°C. with a flux of 1 watt per square metre, or in more practical terms, 10°C. with a flux of 1 watt per square decimetre.
Dividing the thermal conductivity by the electrical conductivity = eliminates the scattering time and gives = At this point of the calculation, Drude made two assumptions now known to be errors. First, he used the classical result for the specific heat capacity of the conduction electrons: c v = 3 2 n k B {\displaystyle c_{v}={\tfrac {3}{2}}nk ...
The Biot number is the ratio of the thermal resistance for conduction inside a body to the resistance for convection at the surface of the body. This ratio indicates whether the temperature inside a body varies significantly in space when the body is heated or cooled over time by a heat flux at its surface.
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance: