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Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and ...
A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic.
Early integrated circuits were packaged in ceramic flat packs, which the military used for many years for their reliability and small size. The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the ...
Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate. This type of packaging can also be divided into two main types: multilayer ceramic packages (like LTCC and HTCC) and pressed ceramic packages.
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