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PMOS uses p-channel (+) metal-oxide-semiconductor field effect transistors (MOSFETs) to implement logic gates and other digital circuits. PMOS transistors operate by creating an inversion layer in an n-type transistor body. This inversion layer, called the p-channel, can conduct holes between p-type "source" and "drain" terminals.
In NMOS-type devices, the zone beneath the gate oxide is a thin n-type inversion layer on the surface of the p-type semiconductor substrate. It is induced by the oxide electric field from the applied gate voltage V G. This is known as the inversion channel. It is the conduction channel that allows the electrons to flow from the source to the ...
In PMOS, the polarities are reversed. The mode can be determined by the sign of the threshold voltage (gate voltage relative to source voltage at the point where an inversion layer just forms in the channel): for an N-type FET, enhancement-mode devices have positive thresholds, and depletion-mode devices have negative thresholds; for a P-type ...
The inversion layer confines the flow of minority carriers, increasing modulation and conductivity, although its electron transport depends on the gate's insulator or quality of oxide if used as an insulator, deposited above the inversion layer. Bardeen's patent as well as the concept of an inversion layer forms the basis of CMOS technology today.
This is known as inversion. The threshold voltage at which this conversion happens is one of the most important parameters in a MOSFET. In the case of a p-type MOSFET, bulk inversion happens when the intrinsic energy level at the surface becomes smaller than the Fermi level at the surface. This can be seen on a band diagram.
Basically the accumulation of the (+)ve charged Donor ions (N D) on the polysilicon enhances the Formation of the inversion channel and when V gs > V th an inversion layer is formed, which can be seen in the figure 1(b) where the inversion channel is formed of acceptor ions (N A) (minority carriers). [3]
The active FET layer is usually deposited onto this substrate using either (i) thermal evaporation, (ii) coating from organic solution, or (iii) electrostatic lamination. The first two techniques result in polycrystalline active layers; they are much easier to produce, but result in relatively poor transistor performance.
An IGBT cell is constructed similarly to an n-channel vertical-construction power MOSFET, except the n+ drain is replaced with a p+ collector layer, thus forming a vertical PNP bipolar junction transistor. This additional p+ region creates a cascade connection of a PNP bipolar junction transistor with the surface n-channel MOSFET. The whole ...