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These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the ...
Capacity loss or capacity fading is a phenomenon observed in rechargeable battery usage where the amount of charge a battery can deliver at the rated voltage decreases with use. [ 1 ] [ 2 ] In 2003 it was reported the typical range of capacity loss in lithium-ion batteries after 500 charging and discharging cycles varied from 12.4% to 24.1% ...
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
New version of operating system ‘addresses an issue that may cause iPhone to run warmer than expected’, Apple says iPhone 15 update: Apple pushes new iOS 17 download to fix hot phones Skip to ...
Yuasa, a producer of 12-volt car batteries, says: “Cold temperatures directly affect the performance of car batteries. In fact, at zero degrees celsius a battery will lose about 30 per cent of ...
Apple iPhone 15 and iPhone 15 Pro Max both reportedly reaching high temperatures
Placing a conductive thick metal plate, referred to as a cold plate, as a heat transfer interface between a heat source and a cold flowing fluid (or any other heat sink) may improve the cooling performance. In such arrangement, the heat source is cooled under the thick plate instead of being cooled in direct contact with the cooling fluid.
The inlet air temperature relates strongly with the heat-sink base temperature. For example, if there is recirculation of air in a product, the inlet air temperature is not the ambient air temperature. The inlet air temperature of the heat sink is therefore higher, which also results in a higher heat-sink base temperature.