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Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.
Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...
The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.
Furnace anneals are performed by equipment especially built to heat semiconductor wafers. Furnaces are capable of processing many wafers at a time, but each process can last between several hours and a day. Increasingly, furnace anneals are being supplanted by Rapid Thermal Anneal (RTA) or Rapid Thermal Processing (RTP). This is due to the ...
One example of these materials is the semiconductor compound ß-Zn 4 Sb 3, which possesses an exceptionally low thermal conductivity and exhibits a maximum zT of 1.3 at a temperature of 670K. This material is also relatively inexpensive and stable up to this temperature in a vacuum, and can be a good alternative in the temperature range between ...
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
Temperature coefficients as low as 1.5–2.0 ppm/°C can be obtained with bandgap references. [a] However, the parabolic characteristic of voltage versus temperature means that a single figure in ppm/°C does not adequately describe the behavior of the circuit. Manufacturers' data sheets show that the temperature at which the peak (or trough ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).