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Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.
Furnace anneals are performed by equipment especially built to heat semiconductor wafers. Furnaces are capable of processing many wafers at a time, but each process can last between several hours and a day. Increasingly, furnace anneals are being supplanted by Rapid Thermal Anneal (RTA) or Rapid Thermal Processing (RTP). This is due to the ...
Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...
One example of these materials is the semiconductor compound ß-Zn 4 Sb 3, which possesses an exceptionally low thermal conductivity and exhibits a maximum zT of 1.3 at a temperature of 670K. This material is also relatively inexpensive and stable up to this temperature in a vacuum, and can be a good alternative in the temperature range between ...
In semiconductor lasers, the carrier lifetime is the time it takes an electron before recombining via non-radiative processes in the laser cavity. In the frame of the rate equations model , carrier lifetime is used in the charge conservation equation as the time constant of the exponential decay of carriers.
Strain engineering refers to a general strategy employed in semiconductor manufacturing to enhance device performance. Performance benefits are achieved by modulating strain, as one example, in the transistor channel, which enhances electron mobility (or hole mobility) and thereby conductivity through the channel. Another example are ...
[3] [4] However, since transferring information between the processor and the outside world does still dissipate energy, superconducting computing was seen as well-suited for computations-intensive tasks where the data largely stays in the cryogenic environment, rather than big data applications where large amounts of information are streamed ...
The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.