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Electrostatic discharge (ESD) is a subclass of electrical overstress and may cause immediate device failure, permanent parameter shifts and latent damage causing increased degradation rate. It has at least one of three components, localized heat generation, high current density and high electric field gradient; prolonged presence of currents of ...
Electrostatic discharge (ESD) is a sudden and momentary flow of electric current between two differently-charged objects when brought close together or when the dielectric between them breaks down, often creating a visible spark associated with the static electricity between the objects.
Electrostatic discharge: An ESD may cause immediate failure of the semiconductor junction, a permanent shift of its parameters, or latent damage causing increased rate of degradation. LEDs and lasers grown on sapphire substrate (see silicon on sapphire ) are more susceptible to ESD damage.
The notion of a symbol for an ESD protection device came about in response to the increased usage and failures of static sensitive components by then the computer systems manufacturer, Sperry Univac. Field repairs to and handling of ESD printed circuit boards (PCBs) were resulting in extremely high failure rates. Studies of PCB failures ...
The charged-device model (CDM) is a model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge (ESD). The model is an alternative to the human-body model (HBM). Devices that are classified according to CDM are exposed to a charge at a standardized voltage level, and then tested for survival.
Warning label for an electrostatic sensitive device, denoting the devices susceptibility to damage. A similar symbol without the bar and with a black "dome" denotes ESD-safe equipment. The human-body model (HBM) is the most commonly used model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge ...
Grounded-gate NMOS, commonly known as ggNMOS, is an electrostatic discharge (ESD) protection device used within CMOS integrated circuits (ICs). Such devices are used to protect the inputs and outputs of an IC, which can be accessed off-chip (wire-bonded to the pins of a package or directly to a printed circuit board) and are therefore subject to ESD when touched.
In electrical engineering, transmission-line pulse (TLP) is a way to study integrated circuit technologies and circuit behavior in the current and time domain of electrostatic discharge (ESD) events. The concept was described shortly after WWII in pp. 175–189 of Pulse Generators , Vol. 5 of the MIT Radiation Lab Series.