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  2. Uline - Wikipedia

    en.wikipedia.org/wiki/Uline

    Uline was founded in 1980 by Elizabeth "Liz" and Richard "Dick" Uihlein. Richard Uihlein is a descendant of the brewers of Schlitz beer. [1] With start-up funds from his father, Edgar Uihlein, Richard and Elizabeth founded the company from their basement after recognizing a local need for a shipping supply distributor.

  3. Photolithography - Wikipedia

    en.wikipedia.org/wiki/Photolithography

    Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate.

  4. Engineering drawing - Wikipedia

    en.wikipedia.org/wiki/Engineering_drawing

    Various scales may be used for different drawings in a set. For example, a floor plan may be drawn at 1:50 (1:48 or 1 ⁄ 4 ″ = 1′ 0″) whereas a detailed view may be drawn at 1:25 (1:24 or 1 ⁄ 2 ″ = 1′ 0″). Site plans are often drawn at 1:200 or 1:100. Scale is a nuanced subject in the use of engineering drawings.

  5. Tagging system - Wikipedia

    en.wikipedia.org/wiki/Tagging_system

    There is currently no legislation in the UK requiring use of a tagging system at a work site or workplace, though it is a legal obligation to inspect all machinery and tools and keep a valid record of said inspections. [1] Equipment should be deemed 'safe to use' before use. Major workplace hazards and legislation required to be met include:

  6. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    NEC and Toshiba used this process for their 4 Mb DRAM memory chips in 1986. [47] Hitachi, IBM, Matsushita and Mitsubishi Electric used this process for their 4 Mb DRAM memory chips in 1987. [37] Toshiba's 4 Mb EPROM memory chip in 1987. [47] Hitachi, Mitsubishi and Toshiba used this process for their 1 Mb SRAM memory chips in 1987. [47]

  7. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab ...

  8. Dorian Shainin - Wikipedia

    en.wikipedia.org/wiki/Dorian_Shainin

    Dorian Shainin (September 26, 1914 – January 7, 2000) was an American quality consultant, aeronautics engineer, author, and college professor most notable for his contributions in the fields of industrial problem solving, product reliability, and quality engineering, particularly the creation and development of the "Red X" concept.

  9. Mixing (process engineering) - Wikipedia

    en.wikipedia.org/wiki/Mixing_(process_engineering)

    Mixing of liquids occurs frequently in process engineering. The nature of liquids to blend determines the equipment used. Single-phase blending tends to involve low-shear, high-flow mixers to cause liquid engulfment, while multi-phase mixing generally requires the use of high-shear, low-flow mixers to create droplets of one liquid in laminar, turbulent or transitional flow regimes, depending ...

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