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Side view of a PCB showing a solder bead and test probe. Bead probe technology is a probing method used to connect electronic test equipment to the device under test (DUT) within a bed of nails fixture. The technique was first used in the 1990s [3] and originally given the name “Waygood Bump” after one of the main proponents, Rex Waygood.
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
Pages in category "Printed circuit board manufacturing" ... Bead probe technology; Blind via; Board-to-board connector; Boundary scan; Boundary scan description language;
Spring loaded pins are a component of the bed of nails tester. A bed of nails tester is a traditional electronic test fixture used for in-circuit testing.It has pins inserted into holes in an epoxy phenolic glass cloth laminated sheet (G-10) which are aligned using tooling pins to make contact with test points on a printed circuit board and are also connected to a measuring unit by wires.
A probe card or DUT board is a printed circuit board (PCB), and is the interface between the integrated circuit and a test head, which in turn attaches to automatic test equipment (ATE) (or "tester"). [2] Typically, the probe card is mechanically docked to a Wafer testing prober and electrically connected to the ATE . Its purpose is to provide ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
An Automated Optical Inspection device. Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
The main advantage of flying probe testing is the substantial cost of a bed-of-nails fixture, costing on the order of US $20,000, [3] is not required. The flying probes also allow easy modification of the test fixture when the PCBA design changes. FICT may be used on both bare or assembled PCB's. [4]