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  2. RCA clean - Wikipedia

    en.wikipedia.org/wiki/RCA_clean

    The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.

  3. SMIF (interface) - Wikipedia

    en.wikipedia.org/wiki/SMIF_(interface)

    Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...

  4. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    The ceilings of semiconductor cleanrooms have fan filter units (FFUs) at regular intervals to constantly replace and filter the air in the cleanroom; semiconductor capital equipment may also have their own FFUs to clean air in the equipment's EFEM which allows the equipment to receive wafers in FOUPs. The FFUs, combined with raised floors with ...

  6. Microfabrication - Wikipedia

    en.wikipedia.org/wiki/Microfabrication

    a wide variety of other processes for cleaning, planarizing, or modifying the chemical properties of microfabricated devices can also be performed. Some examples include: Doping by either thermal diffusion or ion implantation; Chemical-mechanical planarization (CMP) Wafer cleaning, also known as "surface preparation" (see below) Wire bonding

  7. Megasonic cleaning - Wikipedia

    en.wikipedia.org/wiki/Megasonic_cleaning

    Megasonic cleaning is a specialized cleaning method that utilizes high-frequency sound waves to remove contaminants from delicate surfaces. It is particularly effective in industries like semiconductor manufacturing , optics , and medical device production, where precision and gentle cleaning are crucial.

  8. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...

  9. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the wafer for the formation of additional circuit elements. For example, CMP can bring the entire surface within the depth of field of a photolithography system, or selectively remove material based on its position.