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Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...
A hybrid PCB on a ceramic substrate with laser trimmed thick film components DEC J-11 microprocessor using a hybrid PCB. Thin film technology was also employed in the 1960s. Ultra Electronics manufactured circuits using a silica glass substrate. A film of tantalum was deposited by sputtering followed by a layer of gold by evaporation.
The target market for photoimageable thick film pastes is the thick film (hybrid) circuit and component industries plus LTCC and HTCC activities. The technology allows extremely fine lines and structures to be produced with minimal investment in a simple process and use of special paste materials.
It helped propel the IBM System/360 mainframe family to overwhelming success during the 1960s. SLT research produced ball chip assembly, wafer bumping, trimmed thick-film resistors, printed discrete functions, chip capacitors and one of the first volume uses of hybrid thick-film technology.
Sheet resistance is a special case of resistivity for a uniform sheet thickness. Commonly, resistivity (also known as bulk resistivity, specific electrical resistivity, or volume resistivity) is in units of Ω·m, which is more completely stated in units of Ω·m 2 /m (Ω·area/length).
Unpopulated hybrid circuit (Low Temperature Cofired Ceramics) Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time.
Grasshopper Film Acquires ‘Holding Back the Tide,’ Queer Hybrid Documentary About Fate of New York’s Oysters (EXCLUSIVE) Christopher Vourlias March 7, 2024 at 9:03 AM
In 1971, Lechner, F. J. Marlowe, E. O. Nester and J. Tults demonstrated a 2-by-18 matrix display driven by a hybrid circuit using the dynamic scattering mode of LCDs. [3] In 1973, T. Peter Brody , J. A. Asars and G. D. Dixon at Westinghouse Research Laboratories developed a CdSe ( cadmium selenide ) TFT, which they used to demonstrate the first ...