Ad
related to: particle board vs wafer
Search results
Results From The WOW.Com Content Network
Particle board, also known as particleboard or chipboard, is an engineered wood product, belonging to the wood-based panels, manufactured from wood chips and a synthetic, mostly formaldehyde-based resin or other suitable binder, which is pressed under a hot press, batch- or continuous- type, and produced. [1]
Waferboard belongs to the subset of reconstituted wood panel products called flakeboards. [1] It is a structural material made from rectangular wood flakes of controlled length and thickness bonded together with waterproof phenolic resin under extreme heat and pressure.
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
Wax prevents fibers from clumping together during storage. Chips in the case of particle board are also sprayed with a suitable adhesive before the next steps. Fibers or chips are arranged into a uniform "mat" on a conveyor belt. This mat is pre-compressed and then hot-pressed. Hot-pressing activates the adhesive and glues the fibers or chips ...
"Killer defects" are those caused by dust particles that cause complete failure of the device (such as a transistor). There are also harmless defects. A particle needs to be 1/5 the size of a feature to cause a killer defect. So if a feature is 100 nm across, a particle only needs to be 20 nm across to cause a killer defect.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...
Before bonding two wafers, those two solids need to be free of impurities that can base on particle, organic and/or ionic contamination. To achieve the cleanliness without degrading the surface quality, the wafer passes a dry cleaning, e.g. plasma treatments or UV/ozone cleaning, or a wet chemical cleaning procedure. [2]