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In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal paste consists of a polymerizable liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler. Typical matrix materials are epoxies, silicones (silicone grease), urethanes, and acrylates; solvent-based systems, hot-melt adhesives, and pressure-sensitive adhesive tapes are also available.
Silicone gel sheet (beige) Silicone gel sheeting (SGS) has been an effective reduction and preventive scar therapy since 1980. [ 1 ] It was first discovered to be used in treating scars by Perkins in Australia and New Zealand, and first discussed in the thesis of Karen Quinn, a British biomedical engineering student, in 1985.
The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres. The latter are found in products that have much higher dielectric strength, although this comes at the cost of lower thermal conductivity. End-user modding heatsinks may be supplied with thermal adhesive attached (usually a piece of tape).
Silicone rubber is an elastomer composed of silicone—itself a polymer—containing silicon together with carbon, hydrogen, and oxygen. Silicone rubbers are widely used in industry, and there are multiple formulations. Silicone rubbers are often one- or two-part polymers, and may contain fillers to improve properties or reduce cost.
Silicone grease is soluble in organic solvents such as toluene, xylene, mineral spirits, and chlorinated hydrocarbons. It is insoluble in methanol, ethanol, and water. [2] Thermal grease often consists of a silicone-grease base, along with added thermally conductive fillers. It is used for heat-transfer abilities, rather than friction reduction.