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In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits. During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die.
A die is a specialized machine tool used in manufacturing industries to cut and/or form material to a desired shape or profile. Stamping dies are used with a press, [1] as opposed to drawing dies (used in the manufacture of wire) and casting dies (used in molding) which are not. Like molds, dies are generally customized to the item they are ...
Metal fabrication is the creation of metal structures by cutting, bending and assembling processes. It is a value-added [ 1 ] process involving the creation of machines, parts, and structures from various raw materials.
Metalworking generally is divided into three categories: forming, cutting, and joining. Most metal cutting is done by high speed steel tools or carbide tools. [7] Each of these categories contains various processes. Prior to most operations, the metal must be marked out and/or measured, depending on the desired finished product.
Negative cutting [1] (also known as negative matching and negative conforming) is the process of cutting motion picture negative to match precisely the final edit as specified by the film editor. Original camera negative (OCN) is cut with scissors and joined using a film splicer and film cement .
Grinding is a subset of cutting, as grinding is a true metal-cutting process. Each grain of abrasive functions as a microscopic single-point cutting edge (although of high negative rake angle), and shears a tiny chip that is analogous to what would conventionally be called a "cut" chip (turning, milling, drilling, tapping, etc.) [citation needed].
Cutting tool materials must be harder than the material which is to be cut, and the tool must be able to withstand the heat and force generated in the metal-cutting process. Also, the tool must have a specific geometry, with clearance angles designed so that the cutting edge can contact the workpiece without the rest of the tool dragging on the ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
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