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In electronics, a wafer (also called a slice or substrate) [ 1 ] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer.
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface.
GDSII stream format (GDSII), is a binary database file format which is the de facto industry standard for Electronic Design Automation data exchange of integrated circuit or IC layout artwork. [1] It is a binary file format representing planar geometric shapes, text labels, and other information about the layout in hierarchical form (two ...
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography.
An epitaxial wafer[1] (also called epi wafer, [2] epi-wafer, [3] or epiwafer[4]) is a wafer of semiconducting material made by epitaxial growth (epitaxy) for use in photonics, microelectronics, spintronics, or photovoltaics. The epi layer may be the same material as the substrate, typically monocrystaline silicon, or it may be a silicon dioxide ...
The primary application of monocrystalline silicon is in the production of discrete components and integrated circuits.Ingots made by the Czochralski method are sliced into wafers about 0.75 mm thick and polished to obtain a regular, flat substrate, onto which microelectronic devices are built through various microfabrication processes, such as doping or ion implantation, etching, deposition ...
Open Artwork System Interchange Standard (OASIS [3]) is a binary file format used for specification of data structures for photomask production. [4] It's used to represent a pattern an interchange and encapsulation format for hierarchical integrated circuit mask layout information produced during integrated circuit design that is further used for manufacturing of a photomask.